| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board having a high electromagnetic shielding performance, and a manufacturing method thereof. SOLUTION: Signal wires 12 are disposed on one principal surface of a first inter-layer insulator layer 11, and a first ground layer 13 is extended over the other principal surface. A second ground layer 15 is extended over one principal surface of a second inter-layer insulator layer 14, and the other principal surface is stuck to the one principal surface of the first inter-layer insulator layer 11 via a first adhesive 16. Trenches 17 piercing the second ground layer 15 from the first ground layer 13 are provided in parallel along both sides of each signal wire 12, and a conductor layer 18 which is stuck to surfaces of trenches 17 and is electrically connected to the first ground layer 13 and the second ground layer 15 is formed. A second adhesive 19 filling the trenches 17 is formed, and a first cover layer 20 and a second cover layer 21 are stuck via the second adhesive 19. COPYRIGHT: (C)2010,JPO&INPIT |
