| 摘要 |
PROBLEM TO BE SOLVED: To suppress sticking of a material to a mold in a process of forming a relief structure by using a mold. SOLUTION: A method for forming a pattern includes: bringing a composition containing a release agent and a urethane acrylate resin, which is obtained by reacting a tertiary amine, acrylate and isocyanate, into contact with a relief structure provided in a mold, curing the composition as in that state; and releasing the composition after cured from the mold. COPYRIGHT: (C)2010,JPO&INPIT |
