发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the tact time of processing operation for supplying or coating a substrate to be processed with a process liquid using a spinless system, and to form a coating of the process liquid on the substrate with a uniform thickness without uneven coating by a floating carrying system. SOLUTION: In the resist-coating unit (CT) 40, a stage 76 which floats substrates G in the air with the force of air pressure has a carry-in region M<SB>1</SB>; a coating region M<SB>3</SB>and a carry-out region M<SB>5</SB>, which are divided in the substrate transport direction and are lined up. The carry-in region M<SB>1</SB>is larger than the size of the substrates G and carries in new substrates G to be coated. The coating region M<SB>3</SB>is smaller than the size of the substrates G, and the substrates G are supplied with resist liquid R from a resist nozzle 78 above them, when they pass through the region M<SB>3</SB>. The carry-out region M<SB>5</SB>is larger than the size of the substrates G, and the coated substrates G are carried out from the carry-out region M<SB>5</SB>. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010080983(A) 申请公布日期 2010.04.08
申请号 JP20090294325 申请日期 2009.12.25
申请人 TOKYO ELECTRON LTD 发明人 OTA YOSHIHARU
分类号 H01L21/027;B05C13/02;B65G49/06;H01L21/677 主分类号 H01L21/027
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