| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component preventing degradation of characteristics of the electronic component by preventing influence of an out gas; and a method of manufacturing an electronic component. SOLUTION: The mounting structure 2 of an electronic component 1 is used for mounting the electronic component 1 on a base member 3 having connection electrodes 33, 34. The electronic component 1 includes:a functional element 11 having a predetermined function; a first resin protrusion section 24 having a surface covered by covering films 25, 26 including a conductive section electrically connected to the functional element 11; and a second resin protrusion section 15 that is disposed inside an area surrounded by the first resin protrusion section 24, and has adhesion at least on a surface of the second resin protrusion section. The second resin protrusion section 15 mounts the electronic component 1 on the base member 3 while the conductive section of the covering films 25, 26 are in conductive contact with the connection electrodes 33, 34 due to elastic deformation of the first resin protrusion section 24. COPYRIGHT: (C)2010,JPO&INPIT |
