| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-circuit board capable of precisely realizing arranging of a conductive pattern and of preventing the deformation of the printed-circuit board. Ž<P>SOLUTION: The method includes steps of laminating an insulating film 26 on a supporting substrate 2 so as to cover a through-hole 17, by preparing the supporting substrate 2 with the through-hole 17 forms a base insulating layer 3; forms a seed film 21 for forming a conductive pattern 4 on the base insulating layer 3 through vacuum deposition; and then forms the conductive pattern 4 on the base insulating layer 3 via the seed film 21, and thereby obtaining the printed-circuit board 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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