发明名称 REFRIGERATION CAPACITY BANKING FOR THERMAL CYCLING
摘要 A thermal cycling system includes a structure defining a load space, a heating assembly positioned to heat to the load space, and a cooling assembly positioned to cool the load space. The cooling assembly includes a refrigeration circuit and a banking circuit. The refrigeration circuit has a compressor, a refrigeration condenser, a first refrigeration evaporator in direct thermal communication with the load space, a second refrigeration evaporator in parallel with the first evaporator, and primary refrigerant circulating throughout the refrigeration circuit. The banking circuit is gravity fed and includes a banking condenser, a banking evaporator positioned to cool the load space, and a banking refrigerant circulating throughout the banking circuit. The banking condenser includes a collection reservoir to store liquid banking refrigerant and is in thermal communication with the second refrigeration evaporator.
申请公布号 US2010083691(A1) 申请公布日期 2010.04.08
申请号 US20080247418 申请日期 2008.10.08
申请人 VENTUREDYNE, LTD. 发明人 IMMINK DARIN E.;PETERSON CLINTON A.;VELDT ANDREW R.
分类号 F25B7/00;G01M99/00;F25B1/00;F25B5/00 主分类号 F25B7/00
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