| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic element package which allows an electronic element to be efficiently structured and laid out together with a peripheral passive element component required for the electronic element. <P>SOLUTION: The electronic element package includes: a first wiring board having a first land; a second wiring board which has a first surface and a second surface opposite to the first surface and has the first surface mounted on the first wiring board via the first land and has a second land provided on the second surface and has a smaller area than the first wiring board; and an electronic element electrically connected to the second wiring board via the second land. The electronic element is an element (for example, a memory element) including a semiconductor integrated circuit chip, and the second wiring board has a passive element component buried just below the electronic element, wherein the passive element component is a bypass capacitor for the electronic element, a damping resistor, a terminal resistor, a pull-up resistor, or a pull-down resistor. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
