| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a new type of chip capacitor with a reduced manufacturing cost and with a simplified process, which can be replaced with MLCC of ceramic quality having a low loss value. <P>SOLUTION: The manufacturing method includes: a step composed of a capacitor laminate having a dielectric layer consisted of a composite material of a mixture of ceramic powder and polymer as well as first and second inner electrodes formed with a predetermined interval, the capacitor laminates being formed on opposite surfaces of the dielectric layer; a step of forming a cover layer comprising an insulative material on opposite surfaces of the capacitor laminate; a step of forming at least a pair of first and second through hole parts in the capacitor laminate with the cover layer formed thereon so that each of the first and second inner electrodes can expose; a step where plated layers respectively coupled with the first and second inner electrodes are formed in the first and second through hole parts; and a step where the plated layer formed in the first and second through hole parts is cut in a chip unit in accordance with the positions of the first and second through hole parts such that those plated layers are presented respectively to first and second external terminals. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
