发明名称 JOINING STRUCTURE AND JOINING METHOD OF BUS BAR
摘要 <P>PROBLEM TO BE SOLVED: To solder an end part of a bus bar firmly to a joint portion of a circuit board without causing whiskers. Ž<P>SOLUTION: Bus bars 3 are arranged, being spaced apart from each other, on a circuit board 1. An end part of the individual bus bars 3 is bend into a joint 32 which can be brought into surface contact with a joint portion 2 of the circuit board 1. At the bending portion A, a reinforcing portion 33 is integrally formed to keep constant a bending angle between the joint 32 and a proximal end (leg portion 31) of the bus bar 3, allowing the joint 32 to be soldered in contact with the joint portion 2. It is preferred that the edge of the leading end of the joint 32 is non-angular. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010080574(A) 申请公布日期 2010.04.08
申请号 JP20080245374 申请日期 2008.09.25
申请人 KOYO ELECTRONICS IND CO LTD 发明人 CHINO KIMIHITO;URASAKI YUZO
分类号 H05K1/18 主分类号 H05K1/18
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