发明名称 METHOD OF FORMING MASK PATTERN, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a mask pattern that discriminates the formation history of patterns of workpiece materials formed, and to provide a method of manufacturing a semiconductor device. Ž<P>SOLUTION: A sidewall pattern is formed on a long sidewall of a line part of a first line-and-space pattern on a foundation region; a protective pattern that covers and protects part of the line part of the first line-and-space pattern is formed on the first line-and-space pattern; and the protective pattern is used as a mask to wet-etch the line part of the first line-and-space pattern and remove it, thus forming a second line-and-space pattern constructed by a residual pattern portion that leaves behind the line part of the first line-and-space pattern, a first space that is a region from which the line part of the first line-and-space pattern is removed, and a second space that is a region between sidewall patterns adjoining via the space of the first line-and-space pattern. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010080625(A) 申请公布日期 2010.04.08
申请号 JP20080246301 申请日期 2008.09.25
申请人 TOSHIBA CORP 发明人 MINEMURA YOICHI;FUJISAWA TADAHITO
分类号 H01L21/3065;H01L21/027 主分类号 H01L21/3065
代理机构 代理人
主权项
地址