| 发明名称 |
DEVICE CAVITY ORGANIC PACKAGE STRUCTURES AND METHODS OF MANUFACTURING SAME |
| 摘要 |
Structured and Methods for integrating MEMS devices into low-cost organic chip-scale packages, using sealed cavities, are provided.
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| 申请公布号 |
US2010087024(A1) |
申请公布日期 |
2010.04.08 |
| 申请号 |
US20090488137 |
申请日期 |
2009.06.19 |
| 申请人 |
HAWAT NOUREDDINE;NUYTKENS PETER R |
发明人 |
HAWAT NOUREDDINE;NUYTKENS PETER R. |
| 分类号 |
H01L21/98 |
主分类号 |
H01L21/98 |
| 代理机构 |
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