Gehäusekörper für einen Halbleiterchip aus gegossener Keramik mit reflektierender Wirkung und Verfahren zu dessen Herstellung

摘要

The body has a poured ceramic material e.g. aluminum oxide or zirconium oxide, in which a lead frame (2) is partially embedded, and a particle (8) e.g. titanium oxide, with an inflectional action. The lead frame has a chip mounting surface (10), and an adhesive layer such as silicate, is applied on the lead frame. A recess (6) comprises a material e.g. epoxy resin, that partially surrounds a semiconductor chip arranged in the recess. An independent claim is also included for a method for manufacturing a housing body.