SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To increase the mechanical strength of a semiconductor device having a three-dimensional wiring structure by increasing the bonding strength of a through via and an electrode pad.

SOLUTION: A first semiconductor chip 100 and a second semiconductor chip 200 are bonded. An electrode pad 104 is formed in a surface portion of the first semiconductor chip 100. A through via 114 is formed in the second semiconductor chip 200. The electrode pad 104 is formed with a hollowed portion 111, and the bottom part of the through via 114 is embedded in the hollowed portion 111.

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