发明名称 CALCULATOR OF TEMPERATURE OF BONDING PORTION OF SEMICONDUCTOR ELEMENT IN VOLTAGE TYPE POWER CONVERSION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a calculator of a temperature of a bonding portion of a semiconductor element, capable of efficiently calculating the temperature of a bonding portion of a semiconductor element. <P>SOLUTION: The calculator includes: an input means 10 capable of inputting an output voltage command of a semiconductor element of the power converter in which the temperature of the bonding portion of the semiconductor element should be calculated in the voltage type power conversion apparatus, and an output current of the semiconductor element of the calculation target; a memory table (loss-voltage-current three-dimensional table) 8 for indicating the previously stored relation among the loss of the semiconductor element, output voltage command and output current; and an operation means (CPU) capable of reading and outputting the loss of the semiconductor element at a corresponding certain time stored in the memory table 8 on the basis of the output voltage command and the output current at a certain time inputted by the input means 10. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010081713(A) 申请公布日期 2010.04.08
申请号 JP20080246018 申请日期 2008.09.25
申请人 TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEM CORP 发明人 AZUMA KOTARO
分类号 H02M7/48;G01R31/26 主分类号 H02M7/48
代理机构 代理人
主权项
地址