| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing type electronic device having high reliability by eliminating a solder burr formed when a tie bar is cut: to prevent a welding failure between a lead of the resin sealing type electronic device and an external electrode: and to provide a large area for bonding an electronic component to the lead to prevent a connection failure. SOLUTION: In the method for manufacturing the resin sealing type semiconductor device, in a case that a tie bar 9 is cut after a semiconductor chip 2 etc. are mounted on a lead frame 1 and these are resin-sealed, the cutting of the tie bar 9 is performed from the side of the lead frame 1 where a lead burr 10 is formed by presswork. Furthermore, in the resin sealing type electronic device, a chip capacitor 27 is bonded to burr formation surfaces 31 of a lead L1 and an island 21 using conductive paste 33. Since the burr formation surface 31 has a larger surface area than a sagging surface 32, a large bonding area is obtained. A welding surface of the lead L1 to a control electrode 40 is the sagging surface 32 that is opposite to the burr formation surface 31. COPYRIGHT: (C)2010,JPO&INPIT |
