发明名称 |
MANUFACTURING METHODS OF PIEZOELECTRIC DEVICES |
摘要 |
Methods are disclosed for manufacturing piezoelectric devices. An exemplary method comprises the step of bonding a lid wafer, a piezoelectric frame wafer (having a vibrating piece and a outer frame surrounding the vibrating piece), and a base wafer (having at least one wiring through-hole) together. A surface of a unit (typically ball-shaped) of eutectic metal is cleaned and then arranged on the through-hole. The unit of eutectic metal is then melted in a vacuum or inert gas environment to allow the eutectic metal to enter the through-hole.
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申请公布号 |
US2010084086(A1) |
申请公布日期 |
2010.04.08 |
申请号 |
US20090574653 |
申请日期 |
2009.10.06 |
申请人 |
NIHON DEMPA KOGYO CO., LTD. |
发明人 |
ICHIKAWA RYOICHI;UMEKI MITOSHI |
分类号 |
B32B38/10;B32B38/16 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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