| 摘要 |
<p>A module package and a method for fabricating the same is provided to minimize the size of a module package and realize high integration by making a bare-die built in the substrate. A module package(100) comprises a first substrate part(110), a second substrate part(120), a third substrate section(130), and a bare-die(150). The first substrate part is composed of at least one layer, and the second substrate part composed of at least one layer is formed on the first substrate part. The second substrate part has an opening, and the third substrate part is formed on the second substrate part. The third substrate part covers the opening, and a bare-die is formed inside of the second substrate part.</p> |
