发明名称 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD FOR CAMERA MODULE AND CAMERA MODULE FOR PREVENTING FOREIGN SUBSTANCE
摘要 PURPOSE: A printed circuit board for a camera module to prevent a foreign substance and a method for manufacturing the camera module are provided to form a foreign substance blocking coating layer on a fractured surface of a printed circuit board, thereby originally preventing defects due to a foreign substance. CONSTITUTION: A cover film is formed on both sides of a PCB(Printed Circuit Board) for a camera module(150). A punching process is performed to form the external form of the printed circuit board. A coating layer(153) is formed in the side of a punched part(152) of the printed circuit board. If the forming process of the coating layer is completed, a foreign substance is arrested to the coating layer. The separation of the foreign substance is prevented from the side of the punched part. The cover film is removed.
申请公布号 KR20100036037(A) 申请公布日期 2010.04.07
申请号 KR20080095466 申请日期 2008.09.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JUNG JIN
分类号 H04N5/225;G03B17/00;H01L27/146 主分类号 H04N5/225
代理机构 代理人
主权项
地址
您可能感兴趣的专利