发明名称 |
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD FOR CAMERA MODULE AND CAMERA MODULE FOR PREVENTING FOREIGN SUBSTANCE |
摘要 |
PURPOSE: A printed circuit board for a camera module to prevent a foreign substance and a method for manufacturing the camera module are provided to form a foreign substance blocking coating layer on a fractured surface of a printed circuit board, thereby originally preventing defects due to a foreign substance. CONSTITUTION: A cover film is formed on both sides of a PCB(Printed Circuit Board) for a camera module(150). A punching process is performed to form the external form of the printed circuit board. A coating layer(153) is formed in the side of a punched part(152) of the printed circuit board. If the forming process of the coating layer is completed, a foreign substance is arrested to the coating layer. The separation of the foreign substance is prevented from the side of the punched part. The cover film is removed.
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申请公布号 |
KR20100036037(A) |
申请公布日期 |
2010.04.07 |
申请号 |
KR20080095466 |
申请日期 |
2008.09.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, JUNG JIN |
分类号 |
H04N5/225;G03B17/00;H01L27/146 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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