| 摘要 |
PURPOSE: A light emission device is provided to implement various shape and size according to a desired luminescence intensity by manufacturing a plurality of light emitting chips connected in parallel on a same substrate. CONSTITUTION: A plurality of light emitting cells(100) connected in parallel comprises N type semiconductor layer formed on the same board, an active layer, and a p-type semiconductor layer. A plurality of first electrodes(70) is formed on N type semiconductor layer. A first interconnection(75) interlinks a plurality of first electrodes. An insulating layer(80) is formed to have an opening on one part of the p-type semiconductor layer. A second wiring(95) interlinks a plurality of second electrodes(90).
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