| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent moisture present in a hollow resin package interior from sweating on the internal surface of a glass pane by an external temperature variation, allow the adhesive surface of a gelatinous hygroscopic resin to capture dust that is a big barrier to an imaging device, and further realize a high reliability-semiconductor device that does not impact mechanical strain on a semiconductor element. <P>SOLUTION: The semiconductor device has the hollow resin package 1 having an external terminal 5; the semiconductor element 7 bonded onto the bottom in the package interior with a die bond agent; a conductor 10 that electrically connects an internal terminal 3 of the package and an electrode terminal 9 of the element; the hygroscopic resin 13 provided in a region other than the main element surface of the package interior and element backside, and in a region including the electrode terminal of the element and the connection section of the conductor; and a transparent board 12 attached onto the upper surface of a package surrounding device. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
