Method and device for recording physical parameters

摘要

The method involves arranging a sensor (2) on a base (3), for measuring physical parameter of wafer (1). The load acting on the sensor is transformed into bending force by the piezoelectric plastic film of the sensor. An interlayer (9) is formed between the sensor and the base. The thermal load acting on the sensor is absorbed by the interlayer. An independent claim is included for device for measuring physical parameter of wafer.