METHOD FOR MANUFACTURING FUNCTIONAL DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE PROVIDED WITH FUNCTIONAL DEVICE

摘要

A method for manufacturing a functional device is provided with a wafer processing step, a bonding step, a dicing step, a peeling step and a removing step.  In the wafer processing step, a functional thin film (2) is formed on one surface (3a) of a wafer (3) to be the base of a substrate (1).  In the bonding step after the wafer processing step, a protection sheet (6), i.e., an adhesive sheet using an adhesive, is directly bonded on the surface (3a) of the wafer (3), and a dicing sheet (7) is bonded on the other surface (3b) of the wafer (3).  In the dicing step after the bonding step, the protection sheet (6) and the wafer (3) are cut without cutting the dicing sheet (7), and the wafer (3) is divided into a plurality of functional devices (10).  In the peeling step after the dicing step, the protection sheet (6) is peeled from each functional device (10).  In the removing step after the peeling step, an organic material containing the adhesive of the protection sheet (6) adhered on each functional device (10) is removed.