The component (1) has a two-dimensional semiconductor substrate (2) with a first side (3), a second side (4), a surface normal and a set of recesses. An electrically conducting contact layer (8) is arranged on a dielectric passivation layer (6). Contact elements (12) are provided for electrically connecting the contact layer with the substrate. The contact elements fill 50 percentages of the recesses and project beyond the recesses with a projection (13) in the direction perpendicular to the surface normal. The contact elements are made of an easily solderable material. An independent claim is also included for a method for manufacturing a semiconductor component.
