发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>PURPOSE: A substrate processing apparatus is provided to multiply the amount of process by preventing conduction of a substrate with the conduction prevention groove. CONSTITUTION: A transferring unit(5) transfers a plurality of substrates in the state of keeping a retaining holder perpendicular. The retaining holder comprises a hold groove part(22) having a retaining groove(21) supporting the bottom part of the substrate and a conduction prevention groove portion(24). The conduction prevention groove is prepared adjacent to the hold groove part. The substrate is kept when the support of the substrate by the retaining groove is released. The hold groove part and the conduction prevention groove portion are formed as one body.</p>
申请公布号 KR20100036178(A) 申请公布日期 2010.04.07
申请号 KR20090087588 申请日期 2009.09.16
申请人 TOKYO ELECTRON LIMITED 发明人 NAKASHIMA MIKIO
分类号 H01L21/677;H01L21/302 主分类号 H01L21/677
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