发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE: A positive type photosensitive resin composition is provided to ensure high-sensitivity, high definition, excellent residue elimination, and good patterns and to maintain the balance of solid content and viscosity even with a small amount of polybenzoxazole precursor. CONSTITUTION: A positive type photosensitive resin composition comprises (A) 100.0 parts by weight of a polybenzoxazole precursor having a repeating unit represented by chemical formula 1, (B) 5 -100.0 parts by weight of photosensitive diazoquinone compound, (C) 0.1-30 parts by weight of a silane compound, (D) 10-100.0 parts by weight of polyamic acid ester compound, and (E) a solvent.
申请公布号 KR20100036110(A) 申请公布日期 2010.04.07
申请号 KR20080095569 申请日期 2008.09.29
申请人 CHEIL INDUSTRIES INC. 发明人 CHO, HYUN YONG;JUNG, DOO YOUNG;YOO, YONG SIK;JONG, JI YOUNG;LEE, JONG HWA;CHUNG, MIN KOOK;LEE, KIL SUNG;CHA, MYOUNG HWAN
分类号 G03F7/039 主分类号 G03F7/039
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