发明名称 |
POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
PURPOSE: A positive type photosensitive resin composition is provided to ensure high-sensitivity, high definition, excellent residue elimination, and good patterns and to maintain the balance of solid content and viscosity even with a small amount of polybenzoxazole precursor. CONSTITUTION: A positive type photosensitive resin composition comprises (A) 100.0 parts by weight of a polybenzoxazole precursor having a repeating unit represented by chemical formula 1, (B) 5 -100.0 parts by weight of photosensitive diazoquinone compound, (C) 0.1-30 parts by weight of a silane compound, (D) 10-100.0 parts by weight of polyamic acid ester compound, and (E) a solvent.
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申请公布号 |
KR20100036110(A) |
申请公布日期 |
2010.04.07 |
申请号 |
KR20080095569 |
申请日期 |
2008.09.29 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
CHO, HYUN YONG;JUNG, DOO YOUNG;YOO, YONG SIK;JONG, JI YOUNG;LEE, JONG HWA;CHUNG, MIN KOOK;LEE, KIL SUNG;CHA, MYOUNG HWAN |
分类号 |
G03F7/039 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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