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发明名称
Radiant energy heating for die attach
摘要
Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.
申请公布号
US7691671(B2)
申请公布日期
2010.04.06
申请号
US20060590163
申请日期
2006.10.30
申请人
INTEL CORPORATION
发明人
FRUTSCHY KRISTOPHER J.
分类号
H01L21/44
主分类号
H01L21/44
代理机构
代理人
主权项
地址
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