发明名称 |
Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device |
摘要 |
A reliable semiconductor device including support bumps so as to adequately seal the region between the chips is to be provided. The semiconductor device includes a semiconductor chip; a bump formed on an upper face of the semiconductor chip; and a plurality of support bumps formed along a circumference of the region where the bump is provided, formed on the upper face of the semiconductor chip; and a flow path for a sealing resin is provided between the plurality of support bumps, so as to connect the region where the bump is provided and a periphery region of the semiconductor chip.
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申请公布号 |
US7692297(B2) |
申请公布日期 |
2010.04.06 |
申请号 |
US20050172783 |
申请日期 |
2005.07.05 |
申请人 |
NEC ELECTRONICS CORPORATION;NEC CORPORATION |
发明人 |
MIYAZAKI TAKASHI;FUNAYA TAKUO |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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