| 发明名称 |
Audio amplifier assembly |
| 摘要 |
An audio amplifier assembly that includes a semiconductor package having a semiconductor power die tuned for class D amplifier applications and a conductive clip used for low inductance integration into the amplifier circuit.
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| 申请公布号 |
US7692316(B2) |
申请公布日期 |
2010.04.06 |
| 申请号 |
US20050239967 |
申请日期 |
2005.09.30 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
CAO JIANJUN;CEREZO JORGE;DUBHASHI AJIT;ZHAO QUN |
| 分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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