发明名称 Pressure sensor device including temperature sensor contained in common housing
摘要 A pressure sensor device includes a temperature sensor mounted on a common housing composed of a resin head and a resin pipe both hermetically connected to each other. The pressure sensor device is mounted on, for example, on an intake manifold of an internal combustion engine to measure an amount of air supplied to the engine based on detected pressure and temperature of the air. A pressure sensor is mounted on the resin head, and a temperature sensor element is supported in the resin pipe. A lead wire of the temperature sensor element such as a thermistor is electrically connected to a conductor bar embedded in the resin pipe. The temperature sensor is directly exposed to the air in the intake manifold, and a size of the temperature sensor and the lead wire is made small to make a response speed of the temperature sensor element high.
申请公布号 US7690262(B2) 申请公布日期 2010.04.06
申请号 US20080073068 申请日期 2008.02.29
申请人 DENSO CORPORATION 发明人 NAKABAYASHI HIDEKI
分类号 G01L19/04 主分类号 G01L19/04
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