| 摘要 |
A thermal polymer-bonding method includes initially placing into contact certain polymer-based first and second solid media at a first junction. A first superficial portion of the first solid medium is liquefying through the application of thermal energy to the first junction. The liquefied first superficial portion is superficially or topically applied to the second solid medium whereafter the topical application may be solidified via the action of cooling or withdrawal of thermal energy from the first junction. The solidification of the liquid elements, having maximized surface area contact between opposing media, bonds the first solid medium to the second solid medium. A third polymer-based solid medium may then be placed into contact with the first solid medium at a second junction, whereafter certain select second superficial portions of the first and third solid media may be liquefied, and re-solidified to bond the third solid medium to the first solid medium.
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