| 发明名称 |
Moisture curable silicone hot melt |
| 摘要 |
The present invention generally relates to a moisture curable composition in the form of a hot melt. The inventive compositions contain hydrolyzable silyl groups connected to a polymer which is capable of crosslinking when exposed to moisture.
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| 申请公布号 |
US7691959(B1) |
申请公布日期 |
2010.04.06 |
| 申请号 |
US20070926883 |
申请日期 |
2007.10.29 |
| 申请人 |
HENKEL CORPORATION |
发明人 |
LIM THOMAS FAY-OY;DWORAK DAVID;FEDORCHICK JESSICA;CHU HSIEN-KUN |
| 分类号 |
C08G77/04 |
主分类号 |
C08G77/04 |
| 代理机构 |
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