发明名称 Methods of forming films in semiconductor devices with solid state reactants
摘要 A method of self-aligned silicidation involves interruption of the silicidation process prior to complete reaction of the blanket material (e.g., metal) in regions directly overlying patterned and exposed other material (e.g., silicon). Diffusion of excess blanket material from over other regions (e.g., overlying insulators) is thus prevented. Control and uniformity are insured by use of conductive rapid thermal annealing in hot wall reactors, with massive heated plates closely spaced from the substrate surfaces. Interruption is particularly facilitated by forced cooling, preferably also by conductive thermal exchange with closely spaced, massive plates.
申请公布号 US7691750(B2) 申请公布日期 2010.04.06
申请号 US20060595441 申请日期 2006.11.09
申请人 ASM INTERNATIONAL N.V. 发明人 GRANNEMAN ERNEST H. A.;KUZNETSOV VLADIMIR;PAGES XAVIER;VAN DER JEUGD CORNELIUS A.
分类号 H01L21/28;H01L21/44;H01L21/24;H01L21/285;H01L21/336;H01L21/8234;H01L27/088;H01L29/78 主分类号 H01L21/28
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