发明名称 |
Wiring substrate and manufacturing process of the same |
摘要 |
A wiring substrate includes a lower insulating resin layer; wiring pattern layers provided on surfaces of the lower insulating resin layer; upper insulating resin layers; and via holes and via conductors connected electrically with at least one of the wiring pattern layers. An upper insulating resin layer includes an epoxy resin containing 30 to 50% by weight of an inorganic filler of SiO2 having an average grain diameter of 1.0 to 10.0μm, and a via having a lower end opening diameter of between 40μm and 60μm.
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申请公布号 |
US7692103(B2) |
申请公布日期 |
2010.04.06 |
申请号 |
US20040989517 |
申请日期 |
2004.11.17 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
SAIKI HAJIME;SAKURAI MIKIYA |
分类号 |
H05K1/11;H05K3/00;H05K3/02;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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