| 摘要 |
<p>PURPOSE: A light emitting device package and a manufacturing method thereof are provided to control the power supply of a light emitting diode by detecting the temperature of a light emitting device by using a temperature measurement device formed on a package body. CONSTITUTION: A package body(110) including a cavity(111) is prepared. An emitting device(120) is arranged in the cavity. A temperature measuring element(130) is integrated with the package body. A plurality of metal layers(114, 116, 132, 134) are formed on the package body. The emitting device comprises either a color LED chip or a UV LED chip.</p> |
