| 摘要 |
PURPOSE: A polyimide film is provided to ensure excellent transparency and heat resistance, and low dimensional change caused by thermal stress, and to be useful for a transparent conductive film, TFT substrate, and flexible print-circuit board. CONSTITUTION: A polyimide film is obtained through imidization of polyamic acids which is obtained by reacting diamines with acid dianhydrides. A top point of the peak is within 280-380 °C on a tanδ curve, a value that loss modulus is divided by storage modulus. An average transparency at 400-740 nm measured by a UV spectrophotometer based on film thickness of 50~100 micron is 85% or more.
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