发明名称 THERMOSETTING COMPOSITION AND PHOTOSEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting composition capable of achieving excellent heat resistance, light transmission and luminance maintenance rate, and to provide a photosemiconductor device obtained by sealing an optical semiconductor element using the thermosetting composition. <P>SOLUTION: The thermosetting composition includes aluminosiloxane, a silicone oil containing silanol groups at both ends, an epoxy silicone and a silicone elastomer. The thermosetting composition is obtained by mixing a mixture of aluminosiloxane and the silicone oil containing silanol groups at both ends with the epoxy silicone and subsequently with the silicone elastomer, provided that the aluminosiloxane is obtained by reacting the silicone oil containing silanol groups at both ends and aluminum isopropoxide. The photosemiconductor device is obtained by sealing the optical semiconductor element using the thermosetting composition. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010070719(A) 申请公布日期 2010.04.02
申请号 JP20080242653 申请日期 2008.09.22
申请人 NITTO DENKO CORP 发明人 KATAYAMA HIROYUKI
分类号 C08G59/40;C08L63/00;C08L83/05;C08L83/07;C08L83/10;H01L23/29;H01L23/31 主分类号 C08G59/40
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