| 摘要 |
PURPOSE: A spool no ground wire bonding apparatus grounds the bonding wire through the diverter. Abrasion due to the spool earth and noise-problem is prevented. CONSTITUTION: A wire bonding apparatus comprises the wire spool(110), and the capillary(140) and diverter(122). The bonding wire(W) is wound in the wire spool. Capillary interlinks the bonding pad and lead of the semiconductor chip as the bonding wire. It is touched with the bonding wire and diverter keeps the tension of the bonding wire. The bonding wire is grounded with diverter. The bonding wire is not grounded with the wire spool.
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