| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer circuit board that improves heat-dissipation efficiency by heat transfer from electronic components, respectively having a large calorific value, to a metal substrate without placing the electronic components on a surface layer (a first layer) face. <P>SOLUTION: The multilayer circuit board includes: a plate-like laminated circuit part 120 in which conductor layers and resin-made insulating layers are alternately laminated; and a metal substrate part 110 having six MOSFETs 15, 16 mounted thereon. A part excluding an opening in the lower surface of the laminated circuit part 120 is fixed by an adhesive or by screwing or the like so as to be in contact with the upper surface of the metal substrate part 110 while the upper part of the MOSFET is wire-bonded to a wiring conductor 12 of the laminated circuit part 120 via the opening. Such direct mounting of the electronic components on the metal single-layer circuit substrate part 110, rather than on the laminated circuit part 120, achieves improvement in heat dissipation efficiency by heat transfer from the electronic components to the metal substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
