| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device for reforming surface by micro electric discharge that can perform surface reforming on a minimum necessary local area so that processing for improving hydrophilic property may be done only to a targeted desired position by controlling a micro discharge plasma generation area. <P>SOLUTION: Linear high-voltage electrodes arranged at a predetermined interval on a two-dimensional(2D) surface and linear ground electrodes arranged at a predetermined interval on another 2D surface that is practically parallel to the 2D surface are arranged so as to intersect with each other on a 2D projected plan view; a substrate to be processed is arranged between the high-voltage electrodes and ground electrodes; the ground electrodes are brought into conductive contact with the processed substrate, the high-voltage electrodes and the processed substrate are arranged so as to face each other, high voltage is applied between the high-voltage electrodes and the ground electrodes; the high-voltage application area is supplied with a discharge gas to generate fine non-equilibrium discharge plasma; the electric supply operation to the high-voltage electrodes and ground electrodes is controlled; micro discharge plasma is generated at a region where the high-voltage electrodes and ground electrodes cross each other in the 2D projected plan view, thus reforming the desired positions on the surface of the processed substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
