| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for soldering a covered wire with high reliability, and to provide a device therefor. Ž<P>SOLUTION: The soldering method in which the covered wire is mounted at a position where solder is supplied in advance, and pressed and heated by a heater chip to be soldered includes the stages of: mounting the covered wire at the position, pressing the heat chip with a predetermined load for a predetermined time, and heating it at predetermined temperature to fuse the solder and to connect the covered wire to the position; and moving up and down the heater chip at least twice by a fine distance at predetermined time intervals within a time wherein the solder is fused after the heating time. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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