LASER DICING SHEET, AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a laser dicing sheet to be used in the production of semiconductor chips, wherein the dicing sheet is stuck to a circuit surface side of a semiconductor wafer and the wafer is divided to individual pieces for every circuit by the irradiation of laser beam of a short wavelength from the sheet side.

SOLUTION: The laser dicing sheet comprises a base and an adhesive layer formed on one side of the base and has a total light transmittance of≥60% in a wavelength region of 300 to 400 nm and has a haze of≤20% and has a transparent visibility of≥30 for an optical comb width of 0.25 mm.

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