SURFACE PROCESSING METHOD OF PRINTED CIRCUIT BOARD RESIN AND PRINTED CIRCUIT BOARD RESIN

摘要

PROBLEM TO BE SOLVED: To provide a surface processing method of printed circuit board for forming a fine circuit pattern and enhancing adhesive force between a circuit pattern and printed circuit board resin, and provide printed circuit board resin processed by this method.

SOLUTION: The surface processing method of printed circuit board resin includes: a process of providing printed circuit board resin; a process of forming a concave and a convex part on the surface by roughening the surface of the printed circuit board resin; a process of filling a filling agent in the concave part; a process of forming a coated layer by coating with a repellent material the surface of the printed circuit board resin where the concave part is filled with the filling agent; and a process of removing layer the filling agent filled in the concave part and the coated layer corresponding to the filling agent filled in the concave part.

COPYRIGHT: (C)2010,JPO&INPIT