发明名称 |
SEMICONDUCTOR DEVICE WITH LOCAL INTERCONNECT |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with local interconnects. SOLUTION: The semiconductor device with local interconnects includes: a first gate line structure and a second gate line structure disposed on a substrate and substantially collinear; a first pair of source/drain regions formed in the substrate on both sides of the first gate line structure; a second pair of source/drain regions formed in the substrate on both sides of the second gate line structure; and a pair of conductive lines disposed on the substrate on both sides of the first gate line structure and the second gate line structure, such that each conductive line is connected to one of the first pair of source/drain regions and one of the second pair of source/drain regions. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010074158(A) |
申请公布日期 |
2010.04.02 |
申请号 |
JP20090207011 |
申请日期 |
2009.09.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD |
发明人 |
SHO GAKURI;THEI KONG-BENG;CHUNG SHENG-CHEN;LIANG MONG-SONG |
分类号 |
H01L29/417;H01L21/28;H01L21/3205;H01L21/768;H01L21/8234;H01L23/52;H01L23/522;H01L27/088 |
主分类号 |
H01L29/417 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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