| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic part which solves such a problem that, in a method of making a carbon nanotube contact with an electrode at a contact point, the displacement of a semiconductor chip is easily caused after mounting, or electric resistance becomes easily higher in comparison with the case that electric connection is secured by metal bonding. <P>SOLUTION: In the electronic part, a first electrode 12 is formed on the surface of a first substrate 10; on the surface of the first substrate, there is disposed an insulating film 20 in which a first opening 20a is formed at a position corresponding to the first electrode; in the first opening, there is formed a metal member 21 electrically connected with the first electrode; and one terminal of a plurality of carbon nanotubes 55 is embedded in the metal member to be fixed to the metal member. <P>COPYRIGHT: (C)2010,JPO&INPIT |
