| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conditioner for a semiconductor polishing cloth which can satisfactorily ensure grinding properties of a cutting blade and can stably ensure a tool service life over a long period of time and to provide a method for manufacturing a conditioner for a semiconductor polishing cloth and a semiconductor polishing apparatus. <P>SOLUTION: The conditioner for the semiconductor polishing cloth grinds a semiconductor polishing cloth, which is disposed facing a substrate 2, 12, with a cutting blade 4 protruded from the surfaces of the substrates 2, 12. The cutting blade 4 comprises a top surface 5 which faces the semiconductor polishing cloth side, and a wall surface 6 that crosses the top surface 5 and extends to the surface side of the substrate 2, 12. The top surface 5 is covered with a first diamond film 7 having edge parts 7b at a crossed edge line part between the top surface 5 and the wall surface 6. Further, a portion from a surface 7a of the first diamond film 7 to at least the wall surface 6 is covered with a second diamond film 8. <P>COPYRIGHT: (C)2010,JPO&INPIT |
