| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus of manufacturing innovative electronic component which readily carry out peeling and removing of an etching layer and a coating layer of an electrode foil, punching, and processing of a recessed groove in an end surface without using a conventional tool by the irradiation of a laser beam, freely set the shape of a peeling surface, a hole, and a groove in the end surface, and dramatically reduce the electric resistance between the lead terminal and the electrode foil by peeling and removing the etching layer and the coating layer of the electrode foil by the laser beam and by increasing a metallic contact area of a tab of a lead terminal after providing the tab with the metal of the electrode foil, in a method and an apparatus of manufacturing winding type electronic component (especially electrolytic capacitor). SOLUTION: This manufacturing method of winding type electronic component includes steps of: causing the etching layer or the coating layer of the electrode foil 2, i.e., a chemical conversion coating 2a to peel and remove by the laser beam 6 using a laser irradiation device 8 during winding process of an element 9; and performing punching processing and processing a groove 2c recessed to the end surface 2b in the width direction of the electrode foil 2 by the laser beam 6. COPYRIGHT: (C)2010,JPO&INPIT
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