| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive tape which is used when a semiconductor chip mounted on a metallic lead frame is sealed with a resin, thereby preventing a sealing resin from leaking out to the outer lead side, and which can easily be peeled without causing an implantation failure in a wire bonding process and further without an adhesive residue upon separation. <P>SOLUTION: This heat-resistant adhesive tape for manufacturing a semiconductor device is attached when the semiconductor chip mounted on the metallic lead frame is sealed with a resin, and has at least a substrate layer and an active energy ray hardening adhesive layer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
