发明名称 POWER CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power circuit device for inhibiting loss due to eddy current if a large current of high frequency flows, and capable of keeping heat dissipation. SOLUTION: A wiring member 2 in which a large current of high frequency flows is mounted on a metal plate 1 via an insulative magnetic layer 5, and in addition, an electronic component 3 and a switching element 4 are mounted on the wiring member 2. Thus, a magnetic flux generated by the current flowing in the wiring member 2 flows to the magnetic layer 5 with a small magnetic resistance and does not reach the metal plate 1. By making such a shield, generation of eddy current on the metal plate 1 can be inhibited and heat dissipation can be secured by the plate 1. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010073836(A) 申请公布日期 2010.04.02
申请号 JP20080238772 申请日期 2008.09.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 MITSUI TAKAO;HISAOKA YASUSHI;KIKUCHI MASAO
分类号 H05K1/05;H01L25/07;H01L25/18;H02M3/00 主分类号 H05K1/05
代理机构 代理人
主权项
地址