| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer wiring board which is excellent in insulation reliability by achieving stable removal of palladium metal deposited on an insulating layer as an electroless plating catalyst in a semi-additive process of the multilayer wiring board. SOLUTION: The manufacturing method of a multilayer wiring board includes a step (A) of forming the insulating layer on a first conductor circuit and a step (B) of forming a second conductor circuit on the insulating layer by electroless plating and electrolytic plating. The step (A) of forming the insulating layer on the first conductor circuit includes a step (A1) of sticking the insulating layer to the first conductor circuit and a step (A2) of hardening the insulating layer after roughening the surface of the insulating layer, and the step (B) of forming the second conductor circuit on the insulating layer by electroless plating and electrolytic plating includes a step (B1) of depositing palladium metal on the insulating layer during electroless plating, a step (B2) of forming the second conductor circuit, and a step (B3) of removing the deposited palladium metal after formation of the second conductor circuit. COPYRIGHT: (C)2010,JPO&INPIT |
