发明名称 METHOD FOR PRODUCING WAFER LENS ASSEMBLY AND WAFER LENS ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a wafer lens assembly by which a wafer lens and a spacer can be bonded surely. SOLUTION: A method for producing a wafer lens assembly includes: a first diaphragm member forming step of forming a first diaphragm member having a plurality of light transmission parts on one surface of a transparent first substrate; a lens part forming step of forming a plurality of lens parts made of a curing resin at positions corresponding to the plurality of light transmission parts of the first diaphragm member on one surface of the first substrate on which the first diaphragm member is formed; an adhesive applying step of applying an adhesive made of a light curing resin onto a bonding surface to bond the surface of the first substrate on which the first diaphragm member is formed and a second substrate; and a light curing step of facilitating curing of the adhesive by irradiating the adhesive with light from an opposite surface side to the bonding surface of the first substrate after the first substrate and the second substrate are bonded. In the method. the first diaphragm member is formed in such a position as not to prevent the light irradiated in the light curing step from reaching the adhesive. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010072665(A) 申请公布日期 2010.04.02
申请号 JP20100001835 申请日期 2010.01.07
申请人 KONICA MINOLTA OPTO INC 发明人 OKAZAKI NAOKO;HOSOE HIDE;SAITO TADASHI
分类号 G02B3/00;G02B7/02 主分类号 G02B3/00
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